Indium Corporation Expert to Present sTIMs Solution for AI Thermal Challenges at IEEE ECTC May 26-29 · EMSNow
CLINTON, N.Y. — Indium Corporation Applications Development Engineer, Engineered Solder Materials (ESM), Kyle Aserian, will present research on the use of indium-based solder thermal interface materials (sTIMs) to address next-generation AI and high-performance computing thermal challenges at the IEEE Electronic Components and Technology Conference (ECTC), May 26-29, in Orlando, Florida. The presentation, Fluxless Vacuum Formic Acid Reflow of Indium Solder…
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